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Break Microcontroller TI TMS320F28232PGFA Protection

Break Microcontroller TI TMS320F28232PGFA Protection starts from understanding the technology and product features of it:

· High-Performance Static CMOS Technology
– Up to 150 MHz (6.67-ns Cycle Time)
– 1.9-V/1.8-V Core, 3.3-V I/O Design
· High-Performance 32-Bit CPU (TMS320C28x)
– IEEE-754 Single-Precision Floating-Point
Unit (FPU) (F2833x only)
– 16 x 16 and 32 x 32 MAC Operations
– 16 x 16 Dual MAC
– Harvard Bus Architecture
– Fast Interrupt Response and Processing
– Unified Memory Programming Model
– Code-Efficient (in C/C++ and Assembly)
· Six-Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
· 16-Bit or 32-Bit External Interface (XINTF)
– Over 2M x 16 Address Reach
· On-Chip Memory
– F28335, F28235:
256K x 16 Flash, 34K x 16 SARAM
– F28334, F28234:
128K x 16 Flash, 34K x 16 SARAM
– F28332, F28232:
64K x 16 Flash, 26K x 16 SARAM
– 1K x 16 OTP ROM
· Boot ROM (8K x 16)
– With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
– Standard Math Tables
· Clock and System Control

Break Microcontroller TI TMS320F28232PGFA Protection

– Dynamic PLL Ratio Changes Supported
– On-Chip Oscillator
– Watchdog Timer Module
· GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
· Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
· 128-Bit Security Key/Lock
– Protects Flash/OTP/RAM Blocks
– Prevents Firmware Reverse Engineering

· Enhanced Control Peripherals
– Up to 18 PWM Outputs
– Up to 6 HRPWM Outputs With 150 ps MEP Resolution
– Up to 6 Event Capture Inputs
– Up to 2 Quadrature Encoder Interfaces
– Up to 8 32-Bit Timers
(6 for eCAPs and 2 for eQEPs)
– Up to 9 16-Bit Timers
(6 for ePWMs and 3 XINTCTRs)
· Three 32-Bit CPU Timers
· Serial Port Peripherals
– Up to 2 CAN Modules
– Up to 3 SCI (UART) Modules
– Up to 2 McBSP Modules (Configurable as SPI)
– One SPI Module
– One Inter-Integrated-Circuit (I2C) Bus
· 12-Bit ADC, 16 Channels
– 80-ns Conversion Rate
– 2 x 8 Channel Input Multiplexer
– Two Sample-and-Hold
– Single/Simultaneous Conversions
– Internal or External Reference
· Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
· JTAG Boundary Scan Support (1)
· Advanced Emulation Features
– Analysis and Breakpoint Functions
– Real-Time Debug via Hardware
· Development Support Includes
– ANSI C/C++ Compiler/Assembler/Linker
– Code Composer Studio™ IDE
– DSP/BIOS™
– Digital Motor Control and Digital Power Software Libraries
Low-Power Modes and Power Savings from Break Microcontroller TI TMS320F28232PGFA Protection
– IDLE, STANDBY, HALT Modes Supported
– Disable Individual Peripheral Clocks
· Endianness: Little Endian
· Package Options:
– Lead-free, Green Packaging
– Low-Profile Quad Flatpack (PGF, PTP)
– MicroStar BGA™ (ZHH)
– Plastic BGA (ZJZ)

Attack Microchip MCU protective system and extract Embedded Firmware from microcontroller memory, make Microchip MCU cloning unit by provide the same functions as masters;

Attack Microchip MCU protective system and extract Embedded Firmware from memory, make Microchip MCU cloning unit by provide the same functions as masters;

The removal of material is strongly anisotropic (directional). Only the surfaces hit by the ions are removed, sides perpendicular to their paths are not touched. Mechanical polishing is performed with the use of abrasive materials. The process is time-consuming and requires special machines to maintain the planarity of the surface.

From the inspection perspective, the advantages of using polishing over wet and dry etching techniques is the ability to remove layer by layer and view features in the area of interest within the same plane. It is especially useful on multilayer interconnect processes fabricated with advanced planarisation techniques.

Microcontroller Cracking Without Part Number

With MCU design and manufacturing technology continues to evolve, Microcontroller cracking method is also emerging, alteration on Microcontroller’s package, erase silkscreen and burn out pins of Microcontroller as well as other methods being applied on electronic devices at home and abroad, erase silkscreen on Microcontroller is the most common method.

Microcontroller Cracking Without Part Number

For such kind of Microcontroller cracking, must first get to know the exact model number of the Microcontroller, a majority of companies use observation method like assessing the external circuit to estimate the probable models of Microcontroller, due to continuous development of the industry, the limitations of this approach has been growing, mainly in the following several reasons:

1. Because Microcontroller from same company often has compatible pins (for example: MCU from PIC series and MCU of AVR series), so even determine which series of this Microcontroller generously, but still difficult to determine its concrete model;

2. Today, different companies have compatible pins of Microcontroller is also very common (such as EMC78P156 and IC16C54C, etc.), which added more difficult for us to determine the final model number of Microcontroller;

3. Because different companies have different Microcontroller programming port and verified pins distribution, especially the distribution of high-voltage VPP pin is different, so before the Microcontroller model has not been determined, random use of programmer to read the its program (which is currently the most popular approach), it is very likely to cause damage of inside content of flash and eeprom memory.

Break Microcontroller Memory Failure Possibility

Refers to Break Microcontroller Memory success rate, both our customers and us are all very concerned about this questions, we all want a quick one-time successful microcontroller memory Break, but because crack MCU is not a very simple process, sometimes we may encountered many unforeseen problems, even the same microcontroller memory, designers may use different encryption methods, requires different means to copy the content inside microcontroller memory.

Break Microcontroller Memory Failure Possibility

Here we combine our experience to talk about these possibilities of failure during mcu cracking.
Break Microcontroller Memory do have probability of failure, according to our experience and concerning about the probability, there is about 1% of failure probability when break an microcontroller memory, there is 0.3% probability of damage mother microcontroller memory.

Therefore, we can not either guarantee 100% is successful, or guarantee 100% doesn’t destroy or damage mother microcontroller memory, please carefully take this risk into consideration.
But we conduct a careful summary about the failure of IC clone (those parts involve our core technologies are not listed), and engage in a series of measures to reduce this probability to greatest level, the current probability of failure has become lower and lower, furthermore we promise not charge customers any fees if break microcontroller memory content fail.

Attack Microchip IC MCU and extract encrypted code from microcontroller’s memory, program of flash memory and data of eeprom memory will be integrated as a united file called firmware;

Attack Microchip IC MCU and extract encrypted code from microcontroller’s memory, program of flash memory and data of eeprom memory will be integrated as a united file called firmware

There are two main applications of deprocessing. One is to remove the passivation layer, exposing the top metal layer for microprobing attacks. Another is to gain access to the deep layers and observe the internal structure of the chip.

Recover Microchip PIC18F2423 Memory Program

Recover Microchip PIC18F2423 memory program includes recover the content from both eeprom and flash, so it is necessary to get a better knowledge of the internal structure:

12-bit,up to 13-channel Analog-to-Digital
Converter module (A/D):
– Auto-acquisition capability
– Conversion available during Sleep
Dualanalog comparators with input multiplexing
High-currentsink/source 25 mA/25 mA
Threeprogrammable external interrupts
Fourinput change interrupts of IC recoverion
Upto 2 Capture/Compare/PWM (CCP) modules, one with Auto-Shutdown (28-pin devices)
EnhancedCapture/Compare/PWM (ECCP) module (40/44-pin devices only):
– One, two or four PWM outputs
– Selectable polarity
– Programmable dead time
– Auto-shutdown and auto-restart

Recover Microchip PIC18F2423 memory program

MasterSynchronous Serial Port (MSSP) module supporting 3-wire SPI (all 4 modes) and I2C™
Master and Slave modes
EnhancedUSART module:
– Supports RS-485, RS-232 and LIN 1.2
– RS-232 operation using internal oscillator block (no external crystal required)
– Auto-wake-up on Start bit
– Auto-Baud Detect
Run:CPU on, peripherals on
Idle:CPU off, peripherals on
Sleep:CPU off, peripherals off
Idlemode currents down to 5.8 ìA, typical
Sleepmode current down to 0.1 ìA, typical
Timer1Oscillator: 1.8 ìA, 32 kHz, 2V
WatchdogTimer: 2.1 ìA
FourCrystal modes, up to 25 MHz
4xPhase Lock Loop (available for crystal and Two-SpeedOscillator Start-up internal oscillators)
TwoExternal RC modes, up to 4 MHz
TwoExternal Clock modes, up to 25 MHz
Internaloscillator block:
– 8 user-selectable frequencies, from 31 kHz to 8 MHz
– Provides a complete range of clock speeds from 31 kHz to 32 MHz when used with PLL
– User-tunable to compensate for frequency drift
Secondaryoscillator using Timer1 @ 32 kHz
Fail-SafeClock Monitor:
– Allows for safe shutdown if external clock stops

Attack ATmega MCU encryption system by using focus ion beam technique which one of the most commonly used Microcontroller unlocking methods to cut off the security fuse bit and readout Embeded Firmware from microprocessor memory;

Attack ATmega MCU encryption system by using focus ion beam technique which one of the most commonly used Microcontroller unlocking methods to cut off the security fuse bit and readout Embeded Firmware from microprocessor memory

The opposite process to chip fabrication is called deprocessing. A standard CMOS chip has many layers. The deepest doping layers inside the substrate form the transistors. The gate oxide layer isolates the gate from the active area of the transistors. The polysilicon layer on top of it forms the gates and interconnections. The interlayer oxide isolates conducting layers.

Metal layers, usually made of aluminium (Al), form the signal wires, and they are connected with other layers through ‘via’ plugs (Al, W, Ti). Finally, a passivation layer made out of silicon oxide SiO2 or nitride Si3N4 protects the whole structure from moisture and air which could harm the die. In plastic packages the passivation layer is covered with a polymer layer, usually polyimide, to protect against sharp grains in the compound during the package formation.

Microcontroller Break Categories

We can distinguish five major microcontroller break categories:

Microprobing techniques can be used to access the chip surface directly, so we can observe, manipulate, and interfere with the integrated circuit.

Reverse engineering is used to understand the inner structure of semiconductor chip and learn or emulate its functionality. It requires the use of the same technology available to semiconductor manufacturers and gives similar capabilities to the attacker.

Software microcontroller breaks use the normal communication interface of the processor and exploit security vulnerabilities found in the protocols, cryptographic algorithms, or their implementation.

microcontroller break

Eavesdropping techniques allows the microcontroller breaker to monitor, with high time resolution, the analog characteristics of supply and interface connections and any electromagnetic radiation by the processor during normal operation.
Fault generation techniques use abnormal environmental conditions to generate malfunctions in the processor that provide additional access.

All microprobing and reverse engineering techniques are invasive microcontroller breaks. They require hours or weeks in specialised laboratory and in the process they destroy the packaging.

The other three are non-invasive microcontroller breaks. The microcontroller breaked device is not physically harmed during these microcontroller breaks.

The last microcontroller break category could also be semi-invasive. It means that the access to the chip’s die is required but the microcontroller break is not penetrative and the fault is generated with intensive light pulse, radiation, local heating or other means.

Attack ATmega MCU Microcontroller Firmware from flash memory and eeprom memory, then extract the source code from its memory and copy the firmware to new Microprocessor;

Attack ATmega MCU Microcontroller Firmware from flash memory and eeprom memory, then extract the source code from its memory and copy the firmware to new Microprocessor;

The same partial decapsulation technique can be used for smartcards as well (see below figure) although not all of them would maintain electrical integrity. Very often the chip has to be decapsulated completely and then bonded onto a chip carrier. Other methods used for opening the chip packages are described in the literature and only very few of them require expensive tools.

One interesting approach suggests using an acid resistant tape to prevent the acid reacting with unwanted parts. The chip is placed on a glass to prevent lead bending and then covered with acid resistant tape. The tape over the area to be etched is cut away and the whole package is then immersed in a chemical solution to etch away the plastic. This method is limited to QFP, SOP, BGA and other thin packages.