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Microchip MCU PIC16F870 Heximal Code Restoration

The content from original PIC16F870 can be re-attained through Microchip MCU PIC16F870 Heximal Code Restoration procedures:

Microcontroller Core Features:
· High performance RISC CPU
· Only 35 single word instructions to learn
· All single cycle instructions except for program branches which are two-cycle
· Operating speed: DC – 20 MHz clock input DC – 200 ns instruction cycle
· 2K x 14 words of FLASH Program Memory
128 x 8 bytes of Data Memory (RAM) 64 x 8 bytes of EEPROM Data Memory
· Pinout compatible to the PIC16CXXX 28 and 40-pin devices
· Interrupt capability (up to 11 sources)
· Eight level deep hardware stack

· Direct, Indirect and Relative Addressing modes
· Power-on Reset (POR)
· Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
· Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation
· Programmable code protection
· Power saving SLEEP mode
· Selectable oscillator options
· Low power, high speed CMOS FLASH/EEPROM technology
· Fully static design
· In-Circuit Serial Programmingä (ICSPä) via two pins
· Single 5V In-Circuit Serial Programming capability
· In-Circuit Debugging via two pins
· Processor read/write access to program memory
· Wide operating voltage range: 2.0V to 5.5V
· High Sink/Source Current: 25 mA
· Commercial and Industrial temperature ranges
· Low power consumption:
– < 1.6 mA typical @ 5V, 4 MHz
– 20 mA typical @ 3V, 32 kHz
– < 1 mA typical standby current

Microchip MCU PIC16F870 Heximal Code Restoration

Peripheral Features:
· Timer0: 8-bit timer/counter with 8-bit prescaler
· Timer1: 16-bit timer/counter with prescaler, can be incremented during SLEEP via external crystal/clock
· Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
· One Capture, Compare, PWM module
– Capture is 16-bit, max. resolution is 12.5 ns
– Compare is 16-bit, max. resolution is 200 ns
– PWM max. resolution is 10-bit
· 10-bit multi-channel Analog-to-Digital converter
· Universal Synchronous Asynchronous Receiver
Transmitter (USART/SCI) with 9-bit address detection
· Parallel Slave Port (PSP) 8-bits wide, with external RD, WR and CS controls (40/44-pin only)
· Brown-out detection circuitry for Brown-out Reset (BOR)

Recover Freescale MCU MC9S12XDG128 Memory Program

The MC9S12XD family will retain the low cost, power consumption, EMC and code-size efficiency advantages currently enjoyed by users of Freescale’s existing 16-Bit MC9S12 MCU Family.
Based around an enhanced S12 core, the MC9S12XD family will deliver 2 to 5 times the performance of a 25-MHz S12 whilst retaining a high degree of pin and code compatibility with the S12 which makes the Recover Freescale MCU MC9S12XDG128 Memory Program becomes more value effectively.

The MC9S12XD family introduces the performance boosting XGATE module. Using enhanced DMA functionality, this parallel processing module offloads the CPU by providing high-speed data processing and transfer between peripheral modules, RAM, Flash EEPROM and I/O ports. Providing up to 80 MIPS of performance additional to the CPU, the XGATE can access all peripherals, Flash EEPROM and the RAM block.

The MC9S12XD family is composed of standard on-chip peripherals including up to 512 Kbytes of Flash EEPROM, 32 Kbytes of RAM, 4 Kbytes of EEPROM, six asynchronous serial communications interfaces (SCI), three serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, an 8-channel, 10-bit analog-to-digital converter, a 16-channel, 10-bit analog-to-digital converter, an 8-channel pulse-width modulator (PWM), five CAN 2.0 A, B software compatible modules (MSCAN12), two inter-IC bus blocks, and a periodic interrupt timer. The MC9S12XD family has full 16-bit data paths throughout.

Recover Freescale MCU MC9S12XDG128 Memory Program

The non-multiplexed expanded bus interface available on the 144-pin versions allows an easy interface to external memories The inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit operational requirements from Recover Freescale MCU MC9S12XDG128 Memory Program. System power consumption can be further improved with the new “fast exit from stop mode” feature.

In addition to the I/O ports available in each module, up to 25 further I/O ports are available with interrupt capability allowing wake-up from stop or wait mode.
Family members in 144-pin LQFP will be available with external bus interface and parts in 112-pin LQFP or 80-pin QFP package without external bus interface. See Appendix E Derivative Differences for package options.

Reverse Engineering Microchip PIC16F1913 Memory

Reverse Engineering Microchip PIC16F1913 Memory means delayer the silicon, plastic and metal layer from PIC16F1913 and counter sequence of microcontroller manufacturing：

High-Performance RISC CPU:
· Only 35 instructions to learn:
– All single-cycle instructions except branches
· Operating speed:
– DC – 20 MHz oscillator/clock input
– DC – 200 ns instruction cycle
· Program Memory Read (PMR) capability
· Interrupt capability
· 8-level deep hardware stack
· Direct, Indirect and Relative Addressing modes
Special Microcontroller Features:
· Precision Internal Oscillator:
– Factory calibrated to ±1%, typical
– Software selectable frequency range of
8 MHz to 125 kHz
– Software tunable
– Two-Speed Start-up mode
– External Oscillator fail detect for critical applications
– Clock mode switching during operation for power savings
· Software selectable 31 kHz internal oscillator
· Power-Saving Sleep mode
· Wide operating voltage range (2.0V-5.5V)
· Industrial and Extended temperature range
· Power-on Reset (POR)
· Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
· Brown-out Reset (BOR) with software control option
· Enhanced Low-Current Watchdog Timer (WDT) with on-chip oscillator (software selectable nominal 268 seconds with full prescaler) with software enable
· Multiplexed Master Clear with pull-up/input pin
· Programmable code protection
· High-Endurance Flash/EEPROM cell:
– 100,000 write Flash endurance
– 1,000,000 write EEPROM endurance
– Flash/Data EEPROM retention: > 40 years
Low-Power Features:
· Standby Current:
– <100 nA @ 2.0V, typical
· Operating Current:
– 11 ìA @ 32 kHz, 2.0V, typical
– 220 ìA @ 4 MHz, 2.0V, typical
· Watchdog Timer Current:
– 1 ìA @ 2.0V, typical

Reverse Engineering Microchip PIC16F1913 Memory

Peripheral Features:
· Liquid Crystal Display module:
– Up to 60/96/168 pixel drive capability on 28/40/64-pin devices, respectively
– Four commons
· Up to 24/35/53 I/O pins and 1 input-only pin:
– High-current source/sink for direct LED drive
– Interrupt-on-change pin
– Individually programmable weak pull-ups
· In-Circuit Serial Programming™ (ICSP™) via two pins if Reverse Engineering Microchip PIC16F1913 Memory
· Analog comparator module with:
– Two analog comparators
– Programmable on-chip voltage reference (CVREF) module (% of VDD)
– Comparator inputs and outputs externally accessible
· A/D Converter:
– 10-bit resolution and up to 8 channels
· Timer0: 8-bit timer/counter with 8-bit programmable prescaler
· Enhanced Timer1:
– 16-bit timer/counter with prescaler
– External Timer1 Gate (count enable)
– Option to use OSC1 and OSC2 as Timer1 oscillator if INTOSCIO or LP mode is selected
· Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
· Addressable Universal Synchronous
Asynchronous Receiver Transmitter (AUSART)
· Up to 2 Capture, Compare, PWM modules:
– 16-bit Capture, max. resolution 12.5 ns
– 16-bit Compare, max. resolution 200 ns
– 10-bit PWM, max. frequency 20 kHz
· Synchronous Serial Port (SSP) with I2C™

Extract Lattice CPLD Source Code from embedded memory needs to reset the status of CPLD chip from locked to open one by CPLD chip unlocking technique, the content inside the CPLD memory can be readout directly with universal programmer;

Extract Lattice CPLD Source Code from embedded memory needs to reset the status of CPLD chip from locked to open one by CPLD chip unlocking technique, the content inside the CPLD memory can be readout directly with universal programmer

A slightly different approach is required for reverse engineering CPLDs and FPGAs. Even if the security protection is defeated and the attacker manages to extract the configuration bitstream file from the device, he will have to spend a substantial amount of time and effort to convert it into the logic equations and primitive blocks for further simulation and analysis. Meantime, there are some companies on the market, for example Bottom Line Technologies [111], which provide bitstream reverse engineering for CPLDs and FPGAs.

Extract DSP CPLD Encrypted Software from memory start from disable the tamper resistance, by using MCU invasive cracking will help to disclose the internal structure of CPLD chip;

Extract DSP CPLD Encrypted Software from memory start from disable the tamper resistance, by using MCU invasive cracking will help to disclose the internal structure of CPLD chip

When it comes to reverse engineering smartcards and microcontrollers, both structural and program-code reverse engineering are required to understand how the device works. First, the security protection needs to be understood by partial reverse engineering of the chip area associated with it. Thus if memory bus encryption was used, the hardware responsible for this should be reverse engineered. Then, finally, the internal memory contents have to be extracted and disassembled to understand device functions.

Crack Lattice CPLD Embeded Firmware from its memory, copy jed content to blank Lattice CPLD which will provide the same functions as original master CPLD, this microcontroller security unlocking technique can help engineer to extract jed file from master CPLD.

Crack Lattice CPLD Embeded Firmware from its memory, copy jed content to blank Lattice CPLD which will provide the same functions as original master CPLD.

Reverse engineering is a technique aimed at understanding the structure of a semiconductor device and its functions. In case of an ASIC or a custom IC, that means extracting information about the location of all the transistors and interconnections. In order to succeed, a general knowledge of IC and VLSI design is required.

All the layers formed during chip fabrication are removed one-by-one in reverse order and photographed to determine the internal structure of the chip. In the end, by processing all the acquired information, a standard netlist file can be created and used to simulate the device. This is a tedious and time-consuming process, but there are some companies, for example Chipworks [110], which do such work as a standard service.

Crack Microcontroller IC can help engineer to readout Source Code from MCU flash memory and eeprom memory, focus ion beam technique will be applied to remove the tamper resistance system of Microprocessor for Unlocking;

Crack Microcontroller IC can help engineer to readout Source Code from MCU flash memory and eeprom memory, focus ion beam technique will be applied to remove the tamper resistance system of Microprocessor for Unlocking

For wet and dry etching, each type of material requires certain etchants to be used. Some of them have very high selectivity and remove only the desired layer; others affect many layers at a time. For example, silicon and polysilicon can be etched with a mixture of hydrofluoric acid HF and nitric acid HNO3, but HF etches silicon oxide as well.

Other etchants are used for specific purposes, such as doping etchants with a doping-dependent etch rate to make visible doping fronts and p-n junctions. Such etchants are used, for example, to make visible the contents of VTROM in modern smartcards [8]. More information about different etchants and etching technology can be found in the literature on failure analysis techniques.

Reverse engineering ATmel Chip Atmega8L-8PU

Reverse engineering ATmel Chip Atmega8L-8PU means the content from both its eeprom and flash can be extracted and download it to other blank ATmega8L which will provide the same functions:

High-performance, Low-power AVR 8-bit Microcontroller
· Advanced RISC Architecture
– 130 Powerful Instructions – Most Single-clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 16 MIPS Throughput at 16 MHz
– On-chip 2-cycle Multiplier

High Endurance Non-volatile Memory segments

– 8K Bytes of In-System Self-programmable Flash program memory
– 512 Bytes EEPROM
– 1K Byte Internal SRAM
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM (1)(3)
– Data retention: 20 years at 85°C/100 years at 25°C (2)(3)
– Optional Boot Code Section with Independent Lock Bits

In-System Programming by On-chip Boot Program True Read-While-Write Operation
– Programming Lock for Software Security

Peripheral Features
– Two 8-bit Timer/Counters with Separate Prescaler, one Compare Mode
– One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode
– Real Time Counter with Separate Oscillator
– Three PWM Channels
– 8-channel ADC in TQFP and QFN/MLF package

Eight Channels 10-bit Accuracy
– 6-channel ADC in PDIP package

Six Channels 10-bit Accuracy
– Byte-oriented Two-wire Serial Interface
– Programmable Serial USART
– Master/Slave SPI Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator

Reverse Engineering ATmel Chip Atmega8L-8PU

Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated RC Oscillator
– External and Internal Interrupt Sources
– Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby I/O and Packages
– 23 Programmable I/O Lines from Reverse engineering ATmel Chip Atmega8L-8PU
– 28-lead PDIP, 32-lead TQFP, and 32-pad QFN/MLF Operating Voltages
– 2.7 – 5.5V (ATmega8L)
– 4.5 – 5.5V (ATmega8) Speed Grades
– 0 – 8 MHz (ATmega8L)
– 0 – 16 MHz (ATmega8)

Power Consumption at 4 Mhz, 3V, 25°C
– Active: 3.6 mA
– Idle Mode: 1.0 mA
– Power-down Mode: 0.5 µA

Recover TI MSP430G2452 Embedded Memory

Recover TI MSP430G2452 Embedded Memory starts from acquiring its basic structure:

FEATURES
Low Supply Voltage Range: 1.8 V to 3.6 V
Ultra-Low Power Consumption
– Active Mode: 220 µA at 1 MHz, 2.2 V
– Standby Mode: 0.5 µA
– Off Mode (RAM Retention): 0.1 µA
Five Power-Saving Modes
Ultra-Fast Wake-Up From Standby Mode in Less Than 1 µs
16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time

Recover TI MSP430G2452 Embedded Memory

Basic Clock Module Configurations
– Internal Frequencies up to 16 MHz With Four Calibrated Frequencies
– Internal Very-Low-Power Low-Frequency (LF) Oscillator
– 32-kHz Crystal
– External Digital Clock Source One 16-Bit Timer_A With Three Capture/Compare Registers
Up to 16 Touch-Sense Enabled I/O Pins
Universal Serial Interface (USI) Supporting SPI and I2C
recover MCU IC Texas Instruments MSP430G2452IPW14R
recover MCU IC Texas Instruments MSP430G2452IPW14R
10-Bit 200-ksps Analog-to-Digital (A/D)
Converter With Internal Reference, Sample-and-Hold, and Autoscan (MSP430G2x52 Only)
On-Chip Comparator for Analog
Brownout Detector Serial Onboard Programming,
No External Programming Voltage Needed,
Programmable Code Protection by Security Fuse
On-Chip Emulation Logic With Spy-Bi-Wire Interface
Family Members are Summarized in Table 1 Package Options
– TSSOP: 14 Pin, 20 Pin
– PDIP: 20 Pin
– QFN: 16 Pin
For Complete Module Descriptions, See the MSP430x2xx Family User’s Guide (SLAU144)