Crack DSP CPLD IC Chip Memory and extract file from DSP Chip flash memory, DSP IC cracking process normally start from decapsulate the silicon package of CPLD chip;

Crack DSP CPLD IC Chip Memory and extract file from DSP Chip flash memory, DSP IC cracking process normally start from decapsulate the silicon package of CPLD chip

For wet chemical etching we used the Nitrox wet etchant – one of the most effective etching agents for silicon nitride and silicon dioxide passivation layers which selectively removes the passivation layers of integrated circuits while preserving full device functionality.

To observe deeper layers, top aluminium layers were etched away with a 20% water solution of hydrochloric acid HCl or 33% water solution of potassium hydroxide KOH. Although wet etching does not provide good uniformity across the die surface, a lot of information about the internal chip structure can be obtained. Examples of such operations are presented

As can be seen, wet chemical etching does not provide very good uniformity over the surface resulting in some areas where the top metal is not entirely removed and other areas where the underneath layer is starting to be etched. Also, as can be seen in Figure 57, some long metal wires lifted off the surface obstructing the view.

Deprocessing using wet chemical etching does not require much more experience than decapsulation and all the necessary chemicals can be bought for about £100. Care must be taken during the work, as these chemicals are very aggressive and dangerous, especially the ones containing fluorine.