Crack Microcontroller IC can help engineer to readout Source Code from MCU flash memory and eeprom memory, focus ion beam technique will be applied to remove the tamper resistance system of Microprocessor for Unlocking;

Crack Microcontroller IC can help engineer to readout Source Code from MCU flash memory and eeprom memory, focus ion beam technique will be applied to remove the tamper resistance system of Microprocessor for Unlocking

For wet and dry etching, each type of material requires certain etchants to be used. Some of them have very high selectivity and remove only the desired layer; others affect many layers at a time. For example, silicon and polysilicon can be etched with a mixture of hydrofluoric acid HF and nitric acid HNO3, but HF etches silicon oxide as well.

Other etchants are used for specific purposes, such as doping etchants with a doping-dependent etch rate to make visible doping fronts and p-n junctions. Such etchants are used, for example, to make visible the contents of VTROM in modern smartcards [8]. More information about different etchants and etching technology can be found in the literature on failure analysis techniques.

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