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Microchip PIC18F2520 Embedded Firmware Extraction
June 25th, 2013 | 
Author: Microchip PIC18F2520 Embedded Firmware Extraction
Microchip PIC18F2520 Embedded Firmware Extraction needs not only know the memory structure, but also the oscillator structure since it is also important for the power glitch method:
Flexible Oscillator Structure:
· Four Crystal modes, up to 40 MHz
· 4x Phase Lock Loop (PLL) – Available for Crystal and Internal Oscillators
· Two External RC modes, up to 4 MHz
· Two External Clock modes, up to 40 MHz
· Internal Oscillator Block:
– Fast wake from Sleep and Idle, 1 ìs typical
– 8 use-selectable frequencies, from 31 kHz to 8 MHz
– Provides a complete range of clock speeds from 31 kHz to 32 MHz when used with PLL
– User-tunable to compensate for frequency drift
· Secondary Oscillator using Timer1 @ 32 kHz
· Fail-Safe Clock Monitor:
– Allows for safe shutdown if peripheral clock stops
Microchip PIC18F2520 Embedded Firmware Extraction
Converter module:
– Auto-acquisition capability
– Conversion available during Sleep
· Dual Analog Comparators with Input Multiplexing
· Programmable 16-Level High/Low-Voltage
Detection (HLVD) module:
– Supports interrupt on High/Low-Voltage Detection
Special Microcontroller Features:
· C Compiler Optimized Architecture:
– Optional extended instruction set designed to
optimize re-entrant code
· 100,000 Erase/Write Cycle Enhanced Flash
Program Memory Typical
· 1,000,000 Erase/Write Cycle Data EEPROM
Memory Typical
· Flash/Data EEPROM Retention: 100 Years Typical
· Self-Programmable under Software Control
High-Current Sink/Source 25 mA/25 mA
Three Programmable External Interrupts
Four Input Change Interrupts
Up to 2 Capture/Compare/PWM (CCP) modules,
· Priority Levels for Interrupts
· 8 x 8 Single-Cycle Hardware Multiplier
· Extended Watchdog Timer (WDT):
– Programmable period from 4 ms to 131s
one with Auto-Shutdown (28-pin devices)
· Enhanced Capture/Compare/PWM (ECCP)
module (40/44-pin devices only):
– One, two or four PWM outputs
– Selectable polarity
– Programmable dead time
– Auto-shutdown and auto-restart
Copy Lattice CPLD Encrypted File
Copy Lattice CPLD Encrypted File from embedded memory, disable the security fuse by Microcontroller cracking skill and extract the firmware from CPLD chip;
Copy Lattice CPLD Encrypted File from embedded memory, disable the security fuse by Microcontroller cracking skill and extract the firmware from CPLD chip;
Normally a microscope objective has at least two parameters printed on it – magnification and numerical aperture (NA). Modern optical microscopes provide magnification up to 9,000× and 500× magnification is provided by most modern microscopes. Numerical aperture determines the resolving power of an objective, but the total resolution of a microscope system is also dependent upon the numerical aperture of projection optics.
The higher the numerical aperture of the total system the better the resolution. The numerical aperture is related to the angle µ which is one-half of the angular aperture at which the light cone comes to the specimen surface: NA = n sin(µ). The relationship between the numerical aperture and the resolution can used for observation.
Copy DSP CPLD Embeded Firmware
Copy DSP CPLD Embeded Firmware from CPLD memory needs to reverse engineering CPLD and get the CPLD scheme in order to locate the security fuse bit of CPLD, and then use Microcontroller cracking technique to remove the protection;
Copy DSP CPLD Embeded Firmware from CPLD memory needs to reverse engineering CPLD and get the CPLD scheme in order to locate the security fuse bit of CPLD, and then use Microcontroller cracking technique to remove the protection;
The most important tool for reverse engineering silicon chips down to 0.18 µm feature size is an optical microscope with a CCD camera to produce mosaics of high-resolution photographs of the chip surface. Not every microscope would do. As light cannot pass through the chip, the microscope should have reflected light illumination. The image should be sharp and without geometric distortion and colour aberration, otherwise it will not be possible to stick all the images together.
The most important parameters of the microscope are resolution and magnification. The resolution of a microscope mainly depends upon its objective lenses and is defined as the smallest distance between two points on a specimen that can still be distinguished as two separate entities. Resolution is a somewhat subjective value in microscopy because at high magnification an image may appear non-sharp but still be resolved to the maximum ability of the objective.
Extract Lattice CPLD Source Code
Extract Lattice CPLD Source Code from embedded memory needs to reset the status of CPLD chip from locked to open one by CPLD chip unlocking technique, the content inside the CPLD memory can be readout directly with universal programmer;
Extract Lattice CPLD Source Code from embedded memory needs to reset the status of CPLD chip from locked to open one by CPLD chip unlocking technique, the content inside the CPLD memory can be readout directly with universal programmer
A slightly different approach is required for reverse engineering CPLDs and FPGAs. Even if the security protection is defeated and the attacker manages to extract the configuration bitstream file from the device, he will have to spend a substantial amount of time and effort to convert it into the logic equations and primitive blocks for further simulation and analysis. Meantime, there are some companies on the market, for example Bottom Line Technologies [111], which provide bitstream reverse engineering for CPLDs and FPGAs.
Extract DSP CPLD Encrypted Software
Extract DSP CPLD Encrypted Software from memory start from disable the tamper resistance, by using MCU invasive cracking will help to disclose the internal structure of CPLD chip;
Extract DSP CPLD Encrypted Software from memory start from disable the tamper resistance, by using MCU invasive cracking will help to disclose the internal structure of CPLD chip
When it comes to reverse engineering smartcards and microcontrollers, both structural and program-code reverse engineering are required to understand how the device works. First, the security protection needs to be understood by partial reverse engineering of the chip area associated with it. Thus if memory bus encryption was used, the hardware responsible for this should be reverse engineered. Then, finally, the internal memory contents have to be extracted and disassembled to understand device functions.
Crack Lattice CPLD Embeded Firmware
Crack Lattice CPLD Embeded Firmware from its memory, copy jed content to blank Lattice CPLD which will provide the same functions as original master CPLD, this microcontroller security unlocking technique can help engineer to extract jed file from master CPLD.
Crack Lattice CPLD Embeded Firmware from its memory, copy jed content to blank Lattice CPLD which will provide the same functions as original master CPLD.
Reverse engineering is a technique aimed at understanding the structure of a semiconductor device and its functions. In case of an ASIC or a custom IC, that means extracting information about the location of all the transistors and interconnections. In order to succeed, a general knowledge of IC and VLSI design is required.
All the layers formed during chip fabrication are removed one-by-one in reverse order and photographed to determine the internal structure of the chip. In the end, by processing all the acquired information, a standard netlist file can be created and used to simulate the device. This is a tedious and time-consuming process, but there are some companies, for example Chipworks [110], which do such work as a standard service.
Crack DSP CPLD IC Chip File
Crack DSP CPLD IC Chip Memory and extract file from DSP Chip flash memory, DSP IC cracking process normally start from decapsulate the silicon package of CPLD chip;
Crack DSP CPLD IC Chip Memory and extract file from DSP Chip flash memory, DSP IC cracking process normally start from decapsulate the silicon package of CPLD chip
For wet chemical etching we used the Nitrox wet etchant – one of the most effective etching agents for silicon nitride and silicon dioxide passivation layers which selectively removes the passivation layers of integrated circuits while preserving full device functionality.
To observe deeper layers, top aluminium layers were etched away with a 20% water solution of hydrochloric acid HCl or 33% water solution of potassium hydroxide KOH. Although wet etching does not provide good uniformity across the die surface, a lot of information about the internal chip structure can be obtained. Examples of such operations are presented
As can be seen, wet chemical etching does not provide very good uniformity over the surface resulting in some areas where the top metal is not entirely removed and other areas where the underneath layer is starting to be etched. Also, as can be seen in Figure 57, some long metal wires lifted off the surface obstructing the view.
Deprocessing using wet chemical etching does not require much more experience than decapsulation and all the necessary chemicals can be bought for about £100. Care must be taken during the work, as these chemicals are very aggressive and dangerous, especially the ones containing fluorine.
Crack Microcontroller IC Source Code
Crack Microcontroller IC can help engineer to readout Source Code from MCU flash memory and eeprom memory, focus ion beam technique will be applied to remove the tamper resistance system of Microprocessor for Unlocking;
Crack Microcontroller IC can help engineer to readout Source Code from MCU flash memory and eeprom memory, focus ion beam technique will be applied to remove the tamper resistance system of Microprocessor for Unlocking
For wet and dry etching, each type of material requires certain etchants to be used. Some of them have very high selectivity and remove only the desired layer; others affect many layers at a time. For example, silicon and polysilicon can be etched with a mixture of hydrofluoric acid HF and nitric acid HNO3, but HF etches silicon oxide as well.
Other etchants are used for specific purposes, such as doping etchants with a doping-dependent etch rate to make visible doping fronts and p-n junctions. Such etchants are used, for example, to make visible the contents of VTROM in modern smartcards [8]. More information about different etchants and etching technology can be found in the literature on failure analysis techniques.
Posted in Break IC | 
Tags: crack microcontroller ic binary file, crack microcontroller ic embed firmware, crack microcontroller ic encrypt eeprom, crack microcontroller ic flash program, crack microcontroller ic heximal content, crack microcontroller ic protect software, crack microcontroller ic source code | 
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Reverse Engineering ATmel Chip Atmega8L-8PU
Reverse engineering ATmel Chip Atmega8L-8PU
Reverse engineering ATmel Chip Atmega8L-8PU means the content from both its eeprom and flash can be extracted and download it to other blank ATmega8L which will provide the same functions:
High-performance, Low-power AVR 8-bit Microcontroller
· Advanced RISC Architecture
– 130 Powerful Instructions – Most Single-clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 16 MIPS Throughput at 16 MHz
– On-chip 2-cycle Multiplier
High Endurance Non-volatile Memory segments
– 8K Bytes of In-System Self-programmable Flash program memory
– 512 Bytes EEPROM
– 1K Byte Internal SRAM
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM (1)(3)
– Data retention: 20 years at 85°C/100 years at 25°C (2)(3)
– Optional Boot Code Section with Independent Lock Bits
In-System Programming by On-chip Boot Program True Read-While-Write Operation
– Programming Lock for Software Security
Peripheral Features
– Two 8-bit Timer/Counters with Separate Prescaler, one Compare Mode
– One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode
– Real Time Counter with Separate Oscillator
– Three PWM Channels
– 8-channel ADC in TQFP and QFN/MLF package
Eight Channels 10-bit Accuracy
– 6-channel ADC in PDIP package
Six Channels 10-bit Accuracy
– Byte-oriented Two-wire Serial Interface
– Programmable Serial USART
– Master/Slave SPI Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
Reverse Engineering ATmel Chip Atmega8L-8PU
Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated RC Oscillator
– External and Internal Interrupt Sources
– Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby I/O and Packages
– 23 Programmable I/O Lines from Reverse engineering ATmel Chip Atmega8L-8PU
– 28-lead PDIP, 32-lead TQFP, and 32-pad QFN/MLF Operating Voltages
– 2.7 – 5.5V (ATmega8L)
– 4.5 – 5.5V (ATmega8) Speed Grades
– 0 – 8 MHz (ATmega8L)
– 0 – 16 MHz (ATmega8)
Power Consumption at 4 Mhz, 3V, 25°C
– Active: 3.6 mA
– Idle Mode: 1.0 mA
– Power-down Mode: 0.5 µA
Break Microcontroller TI TMS320F28232PGFA Protection
Break Microcontroller TI TMS320F28232PGFA Protection
Break Microcontroller TI TMS320F28232PGFA Protection starts from understanding the technology and product features of it:
· High-Performance Static CMOS Technology
– Up to 150 MHz (6.67-ns Cycle Time)
– 1.9-V/1.8-V Core, 3.3-V I/O Design
· High-Performance 32-Bit CPU (TMS320C28x)
– IEEE-754 Single-Precision Floating-Point
Unit (FPU) (F2833x only)
– 16 x 16 and 32 x 32 MAC Operations
– 16 x 16 Dual MAC
– Harvard Bus Architecture
– Fast Interrupt Response and Processing
– Unified Memory Programming Model
– Code-Efficient (in C/C++ and Assembly)
· Six-Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
· 16-Bit or 32-Bit External Interface (XINTF)
– Over 2M x 16 Address Reach
· On-Chip Memory
– F28335, F28235:
256K x 16 Flash, 34K x 16 SARAM
– F28334, F28234:
128K x 16 Flash, 34K x 16 SARAM
– F28332, F28232:
64K x 16 Flash, 26K x 16 SARAM
– 1K x 16 OTP ROM
· Boot ROM (8K x 16)
– With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
– Standard Math Tables
· Clock and System Control
Break Microcontroller TI TMS320F28232PGFA Protection
– Dynamic PLL Ratio Changes Supported
– On-Chip Oscillator
– Watchdog Timer Module
· GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
· Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
· 128-Bit Security Key/Lock
– Protects Flash/OTP/RAM Blocks
– Prevents Firmware Reverse Engineering
· Enhanced Control Peripherals
– Up to 18 PWM Outputs
– Up to 6 HRPWM Outputs With 150 ps MEP Resolution
– Up to 6 Event Capture Inputs
– Up to 2 Quadrature Encoder Interfaces
– Up to 8 32-Bit Timers
(6 for eCAPs and 2 for eQEPs)
– Up to 9 16-Bit Timers
(6 for ePWMs and 3 XINTCTRs)
· Three 32-Bit CPU Timers
· Serial Port Peripherals
– Up to 2 CAN Modules
– Up to 3 SCI (UART) Modules
– Up to 2 McBSP Modules (Configurable as SPI)
– One SPI Module
– One Inter-Integrated-Circuit (I2C) Bus
· 12-Bit ADC, 16 Channels
– 80-ns Conversion Rate
– 2 x 8 Channel Input Multiplexer
– Two Sample-and-Hold
– Single/Simultaneous Conversions
– Internal or External Reference
· Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
· JTAG Boundary Scan Support (1)
· Advanced Emulation Features
– Analysis and Breakpoint Functions
– Real-Time Debug via Hardware
· Development Support Includes
– ANSI C/C++ Compiler/Assembler/Linker
– Code Composer Studio™ IDE
– DSP/BIOS™
– Digital Motor Control and Digital Power Software Libraries
Low-Power Modes and Power Savings from Break Microcontroller TI TMS320F28232PGFA Protection
– IDLE, STANDBY, HALT Modes Supported
– Disable Individual Peripheral Clocks
· Endianness: Little Endian
· Package Options:
– Lead-free, Green Packaging
– Low-Profile Quad Flatpack (PGF, PTP)
– MicroStar BGA™ (ZHH)
– Plastic BGA (ZJZ)