Texas Instruments MSP430G2313 Microprocessor Breaking
November 6th, 2020 | 
Author: Texas Instruments MSP430G2313 Microprocessor Breaking refers to unlock the protection over msp430g2313 flash memory and eeprom memory, and then extract embedded code from mcu msp430g2313;
JTAG FUSE
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
| PARAMETER | TEST CONDITIONS | MIN | MAX | UNIT | |
| VCC(FB) | Supply voltage during fuse-blow condition | TA = 25°C | 2.5 | V | |
| VFB | Voltage level on TEST for fuse blow | 6 | 7 | V | |
| IFB | Supply current into TEST during fuse blow | 100 | mA | ||
| tFB | Time to blow fuse | 1 | ms |
(1) Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to bypass mode.
Calibration data is stored for both the DCO and for ADC10 organized in a tag-length-value structure by replicate msp430g2152 flash memory data.
La rupture du microprocesseur MSP430G2313 de Texas Instruments consiste à déverrouiller la protection sur la mémoire flash MSP430G2313 et la mémoire EEPROM, puis à extraire le code intégré du MCU MSP430G2313;
Table 10. Tags Used by the ADC Calibration Tags
| NAME | ADDRESS | VALUE | DESCRIPTION |
| TAG_DCO_30 | 0x10F6 | 0x01 | DCO frequency calibration at VCC = 3 V and TA = 30°C at calibration |
| TAG_ADC10_1 | 0x10DA | 0x10 | ADC10_1 calibration tag |
| TAG_EMPTY | – | 0xFE | Identifier for empty memory areas |
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