Component package means the cosmetic performance and soldering point location on the circuit board when it is being assembled, it is definitely space concept. So different components can use same package, same components do have possibility to apply different package. Like Resistor, has traditional DIP package, these kinds of components usually have large size, circuit board must be drilled before assemble, after drilling and insert the components, pass through solder tin oven or manual soldering, the cost could be high, updated designs are all applied small size SMD component, this type of package don’t need drill hole, use stainless stencil as silkscreen to pour solder tin onto surface of circuit board and then place SMD component on it for assembly.

Most common component package datasheet:

RES1，RES2，RES3，RES4；feature is axial series;
RAD：cap; feature is RAD-0.1 to RAD-0.4

Electro; feature is RB.2/.4 to RB.5/1.0
Potentiometer：pot1,pot2；feature is VR-1 to VR-5
Diode：feature is diode-0.4 (low power）diode-0.7 (high power）
Triode：common feature is to-18, to-22(high power triode）to-3(high power NPN）
Regulated power supply has 78 and 79 series；78 series include 7805，7812，7820, etc.
79 series has 7905，7912，7920 etc.
Most common package include TO-126h and TO-126v
Rectifier bridge：BRIDGE1,BRIDGE2: package feature D series（D-44，D-37，D-46）

Comments are closed.