Archive for December, 2011

PostHeaderIcon CPLD Crack method description

Probe Technology

The principle of this technology is exposure internal wire connection, through inspection, manipulation and interfere MCU to achieve CPLD Crack purpose.

For more convenience, people can separate above 4 methods into 2 categories: 1 is intruded cpld crack, this kind of crack will need to decap the package, and then by the assistance of semiconductor testing device, microscope and mini-locator, spend several hours or even weeks can finish in a dedicated lab. All the probe technology can be classified as intruded cpld crack. The other 3 ways belong to un-intruded crack, objects wouldn’t be damaged physically. In some occasion un-intruded CPLD Crack is very dangerous, that is because un-intruded crack device can be self-made and upgrade, cost is very low.

A majority of un-intrude cpld crack need hacker have good knowledge of microprocessor and software. On the contrary, intruded probe cpld mcu ic hack don’t need too much knowledge, moreover can use a set of similar technology to deal with products in wider scope. As a result of that, CPLD Crack normally start from intruded IC crack, accumulated experience will help you develop more economical and faster un-intruded crack technology.